Application
It can be applied to the third generation semiconductor high-power devices, high-power lasers and microelectronic thermal sink devices.
|
Rough Dimension |
≤20*20*10mm |
|
Color |
Above I |
|
Clarity |
Above VS2 |
|
Weight |
（Rough size）≤20.0ct；（Rough Loose Diamond size）≤10.0ct |
|
Remarks |
It can be cut into 1 piece big diamond with≤3 ct and 4 pieces small diamonds with 0.3ct each |
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